waiwai huahana
ANO
E HOAKAKA
waeʻano
Kaapuni Hoʻohui (IC)
Hoʻokomo ʻia - Pūnaehana ma kahi Chip (SoC)
mea hana
AMD Xilinx
moʻo
Zynq® UltraScale+™ MPSoC CG
Pūʻolo
pā
Kūlana Huahana
loaʻa
Hoʻolālā
MCU, FPGA
kaʻina hana kumu
ʻElua Core ARM® Cortex®-A53 MPCore™ me CoreSight™, Dual Core ARM® Cortex™-R5 me CoreSight™
Nui uila
-
Nui RAM
256KB
Pilipili
DMA, WDT
Hoʻohui
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ka māmā holo
533MHz, 1.3GHz
ʻano nui
Zynq® UltraScale+™ FPGA, 103K+ mau pūnaewele loiloi
mahana hana
-40°C ~ 100°C (TJ)
Pūʻolo/Paʻa
784-BFBGA, FCBGA
Mea Hoʻopili Mea Mea Hoʻolako
784-FCBGA (23×23)
helu I/O
252
Helu huahana kumu
XCZU2
Media a me nā hoʻoiho
ANO WAIWAI
LINK
Nā kikoʻī
Zynq UltraScale+ MPSoC Nānā
ʻIke pili kaiapuni
Xiliinx RoHS palapala
Xilinx REACH211 Cert
Ke kumu hoʻohālike EDA/CAD
XCZU2CG-2SFVC784I na SnapEDA
Kaiapuni a me Export Classification
NA ANOAI
E HOAKAKA
kūlana RoHS
Kūlike me nā kikoʻī ROHS3
ʻO ke kiʻekiʻe o ka naʻau (MSL)
4 (72 hola)
kūlana REACH
Nā huahana REACH ʻole
ECCN
5A002A4 XIL
HTSUS
8542.39.0001
