waiwai huahana
ANO
E HOAKAKA
waeʻano
Kaapuni Hoʻohui (IC)
Hoʻokomo ʻia - Pūnaehana ma kahi Chip (SoC)
mea hana
AMD Xilinx
moʻo
Zynq®-7000
Pūʻolo
pā
Kūlana Huahana
loaʻa
Hoʻolālā
MCU, FPGA
kaʻina hana kumu
ʻElua ARM® Cortex®-A9 MPCore™ me CoreSight™
Nui uila
-
Nui RAM
256KB
Pilipili
DMA
Hoʻohui
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ka māmā holo
667MHz
ʻano nui
Kintex™-7 FPGA, 275K mau pūnaewele loiloi
Hana wela
-40°C ~ 100°C (TJ)
Pūʻolo/Paʻa
676-BBGA, FCBGA
Mea Hoʻopili Mea Mea Hoʻolako
676-FCBGA (27×27)
helu I/O
130
Helu huahana kumu
XC7Z035
Media a me nā hoʻoiho
ANO WAIWAI
LINK
Nā kikoʻī
Zynq-7000 All Programmable SoC Overview
XC7Z030,35,45,100 Pepa ʻikepili
Zynq-7000 Ke alakaʻi hoʻohana
ʻIke pili kaiapuni
Xiliinx RoHS palapala
Xilinx REACH211 Cert
Nā Huahana Hōʻikeʻike
Nā polokalamu Zynq®-7000 SoC a pau
PCN Hoʻolālā/Specification
Hoailona Huahana Chg 31/Okt/2016
Pūʻolo PCN
Mea Nui 26/Iun/2017
Kaiapuni a me Export Classification
NA ANOAI
E HOAKAKA
kūlana RoHS
Kūlike me nā kikoʻī ROHS3
ʻO ke kiʻekiʻe o ka naʻau (MSL)
3 (168 hola)
kūlana REACH
Nā huahana REACH ʻole
ECCN
3A991D
HTSUS
8542.39.0001